Aluminium Oxide (Al₂O₃) alumina substrate

Cu Monocrystal Metal Substrate

The Cu Monocrystal Metal Substrate offers unparalleled electrical conductivity and thermal performance, making it an ideal choice for high-precision applications. Its single crystal structure ensures superior mechanical strength, low resistivity, and excellent corrosion resistance.

For inquiry, please give us the following information:

  1. Size with tolerance  
  2. Orientation 
  3. Quantity

Typical Properties

Crystal Structure FCC    a=3.610Å
Growth Method Bridgeman
Density 8.96 g/cm3
Melt Point 1083 °C
Boiling Point 2567 °C
Surface Roughness 30~100 A
Purity 99.9999%
Crystal Defect Tiny bubbles and pit and black spots on polished surface
Orientation
 <100>+/-2.0degree
<110>+/-2.0degree
<111>+/-2.0degree

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