Tantalum Carbide Sputtering Target
Tantalum carbide (TaC) has an extremely high melting point of around 3880°C, combined with high hardness, heat resistance, and durability. Sputtered TaC thin films retain this exceptional thermal stability along with good electrical conductivity.
Sputtered TaC thin films are used as high-temperature thermal barrier coatings for components exposed to extreme heat, such as in gas turbines and spacecraft, where TaC’s very high melting point helps protect against heat stress and oxidation. In semiconductor manufacturing, TaC thin films are used as diffusion barrier layers that prevent copper migration, supporting the reliability of advanced microchips, as well as corrosion-resistant protective coatings.
| Name | Tantalum Carbide |
| Symbol | TaC |
| Purity | 99.5% / higher grades available on request |
| Shape | Disc, Plate |