
Copper-Aluminium-Iron Sputtering Target
Copper-aluminium-iron (CuAlFe, also studied as Al-Cu-Fe) is best known as a quasicrystalline alloy system. When deposited by magnetron sputtering and appropriately annealed, films of this composition can form an icosahedral quasicrystalline phase with high hardness and low friction compared to conventional crystalline metal films.
Sputtered Al-Cu-Fe films have been studied in published research for tribological thin-film coating applications, where the quasicrystalline structure provides high hardness, a low coefficient of friction, good corrosion resistance, and a non-stick surface character, making the material of interest for wear-resistant and anti-adhesive thin-film coatings.
| Name | Copper-Aluminium-Iron alloy |
| Composition | Al63Cu25Fe12 at% (or as requested) |
| Purity | 99.9% |
| Shape | Disc, Plate |

