Copper-Magnesium Sputtering Target

Copper-magnesium (CuMg) is a dilute copper alloy in which magnesium segregates to the film surface during annealing and reacts to form a thin, stable magnesium oxide (MgO) layer. This self-passivating behaviour, established in copper interconnect research, has been used to protect copper films from oxidation without adding a separate passivation step.

Sputtered CuMg thin films are used as copper seed and passivation layers in semiconductor interconnect metallization, where the self-formed MgO surface layer helps prevent oxidation and improve interfacial quality prior to subsequent copper electroplating.

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