Copper-Nickel-Titanium Sputtering Target

Copper-nickel-titanium (CuNiTi, also studied as TiNiCu) is a ternary shape-memory alloy in which copper additions to binary NiTi reduce the temperature hysteresis and composition sensitivity of the martensitic transformation, and improve thermal fatigue performance compared to binary NiTi thin films.

Sputtered CuNiTi thin films are used to fabricate thin-film shape-memory microactuators for MEMS devices, exploiting the narrower thermal hysteresis and faster, more repeatable actuation response compared to binary NiTi films. CuNiTi/piezoelectric heterostructures have also been studied for vibration damping applications in MEMS.

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