Nickel-Vanadium Sputtering Target

Nickel-vanadium (NiV) is a non-magnetic nickel alloy: adding around 7 wt% vanadium suppresses the ferromagnetism of pure nickel, which otherwise reduces sputtering efficiency in magnetron sputtering systems. This makes NiV significantly easier to sputter at high, consistent deposition rates than pure nickel.

Sputtered NiV thin films are widely used as the barrier layer in under-bump metallization (UBM) stacks for flip-chip and solder-bump packaging, where they limit intermetallic compound formation and diffusion between the chip metallization and the solder, helping ensure reliable, long-lasting solder joints.

For inquiry, please give us the following information:

1. Size with tolerance or Drawing
2. Shape
3. Purity
4. Quantity