Tin Silver Sputtering Target

Tin-silver (SnAg) alloy sputtering targets are valued for their excellent electrical conductivity, thermal properties, and mechanical reliability. These targets are widely utilized in the deposition of thin films for electronic applications, including advanced solder layers in semiconductor devices. SnAg films are known for their lower melting point compared to traditional lead-based materials, offering enhanced performance and environmental compliance in electronics manufacturing. The addition of silver improves film uniformity and adhesion, making SnAg an ideal choice for creating reliable interconnects and coatings in high-reliability electronic systems.

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1. Size with tolerance or Drawing
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