Titanium-Copper Sputtering Target

Titanium-copper (TiCu) alloy sputtering targets are recognized for their excellent electrical conductivity and thermal stability, which make them well-suited for thin-film deposition in semiconductor manufacturing. These targets are specifically employed to produce thin films for electrical contacts, connectors, and interconnects, where consistent electrical performance and robust thermal properties are required.

In addition to their functional properties, TiCu sputtering targets contribute to improved film adhesion to substrates, which enhances process reliability by minimizing defects such as delamination. The corrosion resistance of TiCu alloy ensures stable performance even in environments exposed to moisture or corrosive agents, supporting its use in applications demanding high durability.

These characteristics make TiCu sputtering targets an essential material for advancing semiconductor device performance and manufacturing efficiency.

For inquiry, please give us the following information:

1. Size with tolerance or Drawing
2. Shape
3. Purity
4. Quantity