Tungsten-Titanium Sputtering Target

Tungsten-titanium (WTi) alloy sputtering targets are valued for their high melting point, mechanical strength, and excellent adhesion properties, which are critical for semiconductor manufacturing. These targets are widely used in the deposition of barrier layers and interconnects, particularly in advanced integrated circuits. WTi thin films effectively prevent copper diffusion into silicon substrates, a key factor in maintaining the reliability and performance of semiconductor devices.

The unique combination of tungsten and titanium enhances the alloy’s mechanical and thermal stability, making it ideal for high-temperature deposition processes and environments demanding robust structural integrity. These attributes ensure WTi sputtering targets play a pivotal role in improving the durability and functionality of semiconductor components.

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1. Size with tolerance or Drawing
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