Copper-Nickel-Silicon Sputtering Target

Copper-nickel-silicon (CuNiSi) is a precipitation-hardening copper alloy system in which fine Ni2Si intermetallic particles form during ageing, giving a combination of high mechanical strength and high electrical conductivity that is unusual among copper alloys.

This composition family is well established as a bulk lead-frame and electronic connector alloy, where its strength-conductivity balance is highly valued. Sputtered CuNiSi thin films are of interest for reproducing this combination of properties as a functional coating, though dedicated published research on CuNiSi as a sputtered thin film is limited compared to the bulk alloy literature.

For inquiry, please give us the following information:

1. Size with tolerance or Drawing
2. Shape
3. Purity
4. Quantity