Copper-Nickel-Tin Sputtering Target

Copper-nickel-tin (CuNiSn) is a spinodal-strengthened copper alloy system that develops high mechanical strength through a fine-scale, periodic compositional modulation formed during heat treatment, without relying on beryllium as in traditional high-strength copper alloys.

This composition family is established as a beryllium-free, high-strength bulk alloy used for springs and connector contacts. Sputtered CuNiSn thin films are of interest for reproducing this strength and conductivity combination as a functional coating, though dedicated published research on CuNiSn as a sputtered thin film is limited compared to the bulk alloy literature.

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