Copper-Phosphorus Sputtering Target

Copper-phosphorus (CuP) is a copper alloy in which phosphorus acts as a strong deoxidizer, removing dissolved oxygen from the copper matrix. Phosphorus-containing copper coatings are well established in electroless plating chemistry, where they are known to modify grain structure, corrosion resistance, and interfacial behaviour.

Sputtered CuP thin films are of research interest for reproducing the deoxidizing and interfacial properties associated with phosphorus-doped copper coatings in a physical vapour deposition process, as an alternative to the electroless CuP and related NiCuP coatings more commonly reported for microelectronics adhesion and diffusion-barrier applications.

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